The Advantages And Application of Molybdenum Copper

Molybdenum Copper alloy is the composite material of Molybdenum and Copper. It has the similar performances as Tungsten Copper alloy. But its density is less than Tungsten Copper alloy’s, so it is more suitable for spaceflight and navigation industries.

1. Typical Physical and Mechanical Properties:

Material Composition	Density (g/cm3)	Thermal Conductivity W/moK 25°C	Coefficient of Thermal Expansion 10-6/°C
85Mo/15Cu	10.01	195	7.0
80Mo/20Cu	9.96	204	7.6
70Mo/30Cu	9.75	208	8.0
60Mo/40Cu	9.62	223	9.3
50Mo/50Cu	9.51	230	10.3

2. Advantages of Molybdenum Copper (MoCu):

Thermal expansion can be design; High thermal conductivity; Precision flatness capability; Bondable gold plating; Thickness from .004" to .500"; Zero corner radius; Integrated ribs; Precision complex geometry; Low thermal expansion; Good electrical conductivity; High wear resistance; More lighter than W-Cu.

3. Typical areas Application:

Heat Sinks and Spreaders
Microwave Carriers
Microelectronic Package Bases and Housings
Ceramic Substrate Carriers
GaAs and Silicon Device Mounts
Laser Diode Mounts
Surface Mount Package Conductors
Microprocessor Lids
Rocket Parts
Optical Packages
Power Packages
Butterfly Packages